Epoxy Resin Black Durostone Sheet for SMT Fixture, Black Durostone Pallet for Wave Soldering and Reflow Soldering, Wave Soldering Pallets Material

• Customization: Available
• Metal Coating: Fiberglass
• Mode of Production: SMT
• Model NO.: Epoxy resin laminates for Solder pallet
• Layers: Multilayer
• Base Material: Epoxy Fiberglass
• Certification: RoHS, ISO9001
• Customized: Customized
• Condition: New
• Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Motor, Insulating Varnish, Switch Baseplate, Resin
• Type: Insulation Sheet
• Chemistry: Hybrid Insulation
• Maximum Voltage: >100kv
• Color: Dark Geen
• Material: Fiberglass & Resin
• Thermal Rating: 300
• Classification: Fiber Glass& Epoxy Resin
• Brand: Durostone
• Transport Package: Carton&Pallet
• Specification: Size(WidthxLength): 1020*1220mm 1220*2040mm
• Trademark: xinrui
• Origin: China
• HS Code: 3921909010
• Production Capacity: 50000
• Package Size: 2040.00cm * 1220.00cm * 50.00cm
• Package Gross Weight: 1000.000kg

Product Description

Solder pallet material are composite material made of glass fiber and epoxy resin.In the indirect high temperature environment of 260-280ºC, it has good dimensional stability, corrosion resistance, low thermal conductivity, anti-static and non-flammability. Suitable for soldering protection in SMT wave soldering process, easy to process, no cracking, no peeling, no burr and no irritation to human body.Easy to process on CNC lathe and do less harm to the cutters.We have the unique automatic production line in China,therefore steady production can be assured,that can also avoid problems like porosity ,transformation and layer separation. All these problems are easily seen in handmade production.
These materials offer the following features:
(1)Corrosion Resistance:Based on our own intellectual property and R&D Capability.Our composite sheets have great advantage over that of other domestic producers. The carrier life has been prolonged effectively.
(2)Less Burr after machining,not easy to be separated and break on the processing position.

(3)Uniform ESD,No porosity,No impurity,Uniform fiber distribution.
Applications: Manufacturing solder pallets for wave-solder applications of PCB,IR-reflow, and conformal coating operations.